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TRF3705
www.ti.com
SLWS223A – AUGUST 2011 – REVISED OCTOBER 2011
THERMAL INFORMATION
TRF3705
THERMAL METRIC (1)
RGE (VQFN)
24 PINS
UNITS
θ JA
θ JCtop
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
38.4
42.5
θ JB
ψ JT
ψ JB
θ JCbot
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
16.6
0.9
16.6
6.6
° C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 .
ELECTRICAL CHARACTERISTICS: GENERAL
Over recommended operating conditions ; at power supply = 3.3 V and T A = +25 ° C, unless otherwise noted.
PARAMETERS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC PARAMETERS
I CC
Total supply current
T A = +25 ° C, device on (PD = low)
T A = +25 ° C, device off (PD = high)
306
35
mA
μ A
LO INPUT
LO low frequency
300
MHz
f LO
LO high frequency
4000
MHz
LO input power
– 10
0
+15
dBm
BASEBAND INPUTS
V CM
BW
I and Q input dc common-mode
voltage
1-dB input frequency bandwidth
0.25
1000
0.5
V
MHz
Z I
Input impedance
Resistance
Parallel capacitance
8
4.6
k Ω
pF
POWER ON/OFF
Turn on time
Turn off time
PD = low to 90% final output power
PD = high to initial output power – 30 dB
0.2
0.2
μ s
μ s
DIGITAL INTERFACE
V IH
V IL
PD high-level input voltage
PD low-level input voltage
2
0.8
V
V
Copyright ? 2011, Texas Instruments Incorporated
Product Folder Link(s): TRF3705
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